https://www.globalbiotechinsights.com/tag/215/5g IDTechEx provides independent analysis on the development and application of RFID, Printed Electronics, Photovoltaics and Energy Harvesting en Copyright (C) IDTechEx Ltd The emergence of 5G and 6G telecommunications, along with the rise of data center demand and advanced automotive radar systems, is presenting a need for low-loss materials to optimize transmission. This article explores how low-loss materials can prevent transmission losses associated with higher sensitivities and frequencies.https://www.idtechex.com/en/research-article/optimizing-signal-for-communication-and-radar-with-low-loss-materials/34537?rsst2id=215https://www.idtechex.com/en/research-article/optimizing-signal-for-communication-and-radar-with-low-loss-materials/34537?rsst2id=215Wed, 01 Apr 2026 ZZZl.schuett@idtechex.com (Lily-Rose Schuett) High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", goes into detail about emerging technologies, including 2.5D and 3D packaging.https://www.idtechex.com/en/research-article/2-5d-and-3d-idtechex-explores-advanced-semiconductor-packaging/31643?rsst2id=215https://www.idtechex.com/en/research-article/2-5d-and-3d-idtechex-explores-advanced-semiconductor-packaging/31643?rsst2id=215Fri, 30 Aug 2024 ZZZl.schuett@idtechex.com (Lily-Rose Schuett) The signing of the Stockholm Convention on Persistent Organic Pollutants (POPs) in 2001 marked a historic moment, as it was the first global treaty aimed at eliminating or restricting chemicals harmful to human and environmental health. The addition of perfluorooctanesulfonic acid (PFOS) to the Convention in 2009 marked yet another milestone, as PFOS and its related substances became the first of the PFAS family to be regulated on an international levelhttps://www.idtechex.com/en/research-article/new-regulations-targeting-forever-chemicals/30920?rsst2id=215https://www.idtechex.com/en/research-article/new-regulations-targeting-forever-chemicals/30920?rsst2id=215Wed, 24 Apr 2024 ZZZs.dadhania@idtechex.com (Sona Dadhania) Thursday 2 May 2024 - Forever Chemicals: Insights into Regulations Affecting PFAS and Potential Alternatives; The definition and scope of PFAS; Concerns about the effects of PFAS exposure; Regulatory frameworks impacting PFAS worldwide; Emerging applications utilizing PFAS; Potential alternatives for PFAS in selected emerging applicationshttps://www.idtechex.com/en/research-article/webinar-forever-chemicals-insights-into-regulations-affecting-pfas/30890?rsst2id=215https://www.idtechex.com/en/research-article/webinar-forever-chemicals-insights-into-regulations-affecting-pfas/30890?rsst2id=215Tue, 23 Apr 2024 ZZZl.rogers@idtechex.com (Lucy Rogers) 3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.https://www.idtechex.com/en/research-article/3d-electronics-empowering-markets-with-greater-integration/30908?rsst2id=215https://www.idtechex.com/en/research-article/3d-electronics-empowering-markets-with-greater-integration/30908?rsst2id=215Mon, 22 Apr 2024 ZZZz.wang@idtechex.com (Dr Zixin Wang) Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.https://www.idtechex.com/en/research-article/role-of-3d-cu-cu-hybrid-bonding-in-powering-future-hpc-and-ai-products/30902?rsst2id=215https://www.idtechex.com/en/research-article/role-of-3d-cu-cu-hybrid-bonding-in-powering-future-hpc-and-ai-products/30902?rsst2id=215Thu, 18 Apr 2024 ZZZy.chang@idtechex.com (Dr Yu-Han Chang) IDTechEx Research announces the availability of a new report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets". This IDTechEx report assesses the competing technologies that will enable PCBs to be replaced with integrated electronics. It covers technologies, materials, and applications of electronics added to 3D surfaces, in-mold electronics (IME), and fully printed 3D electronics.https://www.idtechex.com/en/research-article/idtechex-release-new-global-3d-electronics-market-report/30885?rsst2id=215https://www.idtechex.com/en/research-article/idtechex-release-new-global-3d-electronics-market-report/30885?rsst2id=215Fri, 12 Apr 2024 ZZZc.martin@idtechex.com (Charlotte Martin) Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.https://www.idtechex.com/en/research-article/the-role-of-printed-sensors-in-mass-digitization/30845?rsst2id=215https://www.idtechex.com/en/research-article/the-role-of-printed-sensors-in-mass-digitization/30845?rsst2id=215Thu, 11 Apr 2024 ZZZj.howley@idtechex.com (Dr Jack Howley) Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.https://www.idtechex.com/en/research-article/aip-market-dynamics-drivers-and-challenges-in-5g-and-6g/30777?rsst2id=215https://www.idtechex.com/en/research-article/aip-market-dynamics-drivers-and-challenges-in-5g-and-6g/30777?rsst2id=215Wed, 03 Apr 2024 ZZZy.chang@idtechex.com (Dr Yu-Han Chang) "Forever chemicals", or PFAS, are coming under increasing regulatory pressure globally as concerns over the negative effects of PFAS on human health and the environment are mounting. In their brand new report, "Per- and Polyfluoroalkyl Substances (PFAS) 2024: Emerging Applications, Alternatives, Regulations", IDTechEx dives deeply to explore the future trajectory of PFAS in five key emerging applications: thermal management for data centers, sustainable food packaging, electric vehicles, low-loss materials for 5G, and the hydrogen economy.https://www.idtechex.com/en/research-article/which-high-tech-industries-need-to-find-alternatives-for-pfas/30733?rsst2id=215https://www.idtechex.com/en/research-article/which-high-tech-industries-need-to-find-alternatives-for-pfas/30733?rsst2id=215Mon, 25 Mar 2024 ZZZs.dadhania@idtechex.com (Sona Dadhania) Thursday 11 April 2024 - An overview of key printed and flexible sensor technologies and printed sensor material requirements? A critical evaluation of historic printed sensor market successes and shortcomings? Evolving and emerging trends and commercial use cases of printed and flexible sensors? Market opportunities and market forecast overview?https://www.idtechex.com/en/research-article/webinar-how-and-why-is-the-printed-and-flexible-sensor-market-evolving/30712?rsst2id=215https://www.idtechex.com/en/research-article/webinar-how-and-why-is-the-printed-and-flexible-sensor-market-evolving/30712?rsst2id=215Fri, 22 Mar 2024 ZZZl.rogers@idtechex.com (Lucy Rogers) Sensors are vital in modern life. They measure a vast quantity of metrics and parameters, acting as the interface between the physical and digital worlds. Printed sensors can be produced in large areas on flexible substrates, reducing costs and unlocking new market opportunities. The new IDTechEx report, "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets", breaks down key trends by technology approach - highlighting both opportunities and challenges for the industry forecast to reach US$960 million by 2034.https://www.idtechex.com/en/research-article/printed-sensor-technology-evolving-to-meet-new-market-demands/30667?rsst2id=215https://www.idtechex.com/en/research-article/printed-sensor-technology-evolving-to-meet-new-market-demands/30667?rsst2id=215Wed, 13 Mar 2024 ZZZj.howley@idtechex.com (Dr Jack Howley) Thursday 14 March 2024 - Exploring Antenna Packaging Technologies: From 5G mmWave to 6G; An overview of antenna packaging technologies for high frequency telecommunication; Antenna packaging strategies for mmWave; Antenna packaging strategies for 6G (beyond 100 GHz)https://www.idtechex.com/en/research-article/upcoming-webinar-exploring-antenna-packaging-technologies/30622?rsst2id=215https://www.idtechex.com/en/research-article/upcoming-webinar-exploring-antenna-packaging-technologies/30622?rsst2id=215Wed, 06 Mar 2024 ZZZl.rogers@idtechex.com (Lucy Rogers) As the world awaits the full take-off of the next generation of telecommunication technologies, 5G, important stakeholders are preparing for the future of future telecommunications - 6G. This may seem premature, given that deployment of 5G infrastructure and base stations are not nearly at their peak yet.https://www.idtechex.com/en/research-article/road-to-6g-the-emerging-low-loss-materials-enabling-future-telecoms/30639?rsst2id=215https://www.idtechex.com/en/research-article/road-to-6g-the-emerging-low-loss-materials-enabling-future-telecoms/30639?rsst2id=215Mon, 04 Mar 2024 ZZZs.dadhania@idtechex.com (Sona Dadhania) Millimeter-wave (mmWave), previously confined to military, satellite, and automotive radar applications, has now entered the mobile communications frequency spectrum, offering high data throughput of up to 20 Gbps with an ultralow latency of just 1 ms.https://www.idtechex.com/en/research-article/advancing-integration-in-antenna-packaging-technologies-for-5g-and-6g/30627?rsst2id=215https://www.idtechex.com/en/research-article/advancing-integration-in-antenna-packaging-technologies-for-5g-and-6g/30627?rsst2id=215Tue, 27 Feb 2024 ZZZy.chang@idtechex.com (Dr Yu-Han Chang)